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Optical microscopy 3D measurement
Optical microscopy 3D measurement
Step groove (Microscopic)
Surface Defect(Microscopic)
Warping/Straightness (Microscopic)
Surface roughness (Microscopic)
Step/groove (Macroscopic)
Angle/Radian(Macroscopic)
Flatness/Parallelism(Macroscopic)
Wafer TTV/BOW/WARPAGE(Macroscopic)
Non standard customized in-depth development
Non standard customized in-depth development
Real time monitoring of laser welding
Long distance thinning thickness monitor
High precision positioning of wafer coupling
Fusion of 2D/3D defect discrimination
3D Rotating Scanning of bore inner wall
Roundness and cylindricity runout
Large stroke sample measurement
Long distance 3D contour measurement
Microscopic dynamic 3D vibration testing
Microscopic dynamic 3D vibration testing
MEMS microphone
MEMS pressure sensing
MEMS cantilever
MEMS dynamic 3D amplitude
CMUT
MEMS comb shaped drive
MEMS comb shaped drive
MENS
Macro dynamic 3D vibration testing
Macro dynamic 3D vibration testing
Ultrasonic welding electrode
Bicycle bracket
Acoustical vibration
Turbine blade vibration
Automotive NVH
Drone wing vibration
Traffic speed measurement
Speed sensor
Optical microscopy 3D measurement
Optical microscopy 3D measurement
3D White Light Interference Imaging System
3D Spectral Confocal Imaging System
Wafer Thickness Mapping System
3D laser frequency comb imaging system
Non standard customized in-depth development
Non standard customized in-depth development
Real time monitoring of laser welding
Long distance thinning thickness monitor
High precision positioning of wafer coupling
Fusion of 2D/3D defect discrimination
3D Rotating Scanning of bore inner wall
Roundness and cylindricity runout
Large stroke sample measurement
Long distance 3D contour measurement
Microscopic dynamic 3D vibration testing
Microscopic dynamic 3D vibration testing
Microscopic laser vibrometer
Macro dynamic 3D vibration testing
Macro dynamic 3D vibration testing
Full field scanning laser vibrometer
Robot vibration measurement station
Single point laser vibrometer
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HOMETECHNICAL
  • Measurement Plan
  • Measuring Principle
  • Indicator Concept
  • Process Scheme
2024
12-05
What are the effects of abrasive morphol...
The morphology and dispersion medium of abrasives have a significant impact on the grinding quality of 4H silicon carbide (4H SiC) chips. The following is a detailed analysis of this impact:1、 The influence of abrasive morphologyThe morphol...
2024
12-02
How is the filtering value for roughness...
1、 Selection of Sampling Length and Evaluation LengthSampling length: It is a reference line length used to determine the surface roughness characteristics. It should be large enough to contain sufficient surface details to accurately refle...
2024
11-21
Poor flatness of the bonding surface bet...
When the flatness of the bonding surface between the bottom of the IGBT package and the heat sink is poor, a series of adverse effects will occur:Reduced contact area: Poor flatness of the bonding surface leads to a decrease in the contact ...
2024
11-18
Poor flatness of IGBT chips leads to str...
Stress concentration: When the flatness of IGBT chips is poor, there may be unevenness on the surface of the chip. These uneven areas are prone to stress concentration when subjected to external forces or temperature changes. Especially at ...
2024
11-17
The correlation between the increase in ...
Reduce effective contact area: When the surface flatness of IGBT chips is poor, the contact surface between the chip and the heat sink will no longer be completely adhered. Due to the unevenness of the chip surface, some areas will not be a...
2024
11-17
Why is the minimum roughness required to...
1、 Reduce the impact of other geometric shape errorsThe purpose of specifying the sampling length (i.e. a part or basis of the evaluation length) is to limit and reduce other geometric errors, especially the influence of surface wave roughn...
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400 6550 650

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