2024
12-12
Device and method for single-sided polis...
The device and method for single-sided polishing of wafers mainly involve the field of semiconductor equipment technology. The following is a detailed introduction to it:1、 Single sided polishing device for wafersThe single-sided polishing ...
2024
12-11
The difference between "display resoluti...
Display resolutionDefinition: Display resolution, also known as pixel resolution, refers to the resolution of a display when displaying an image. It represents the total number of horizontal and vertical pixels on the display. For example, ...
2024
12-11
Principle of Heterodyne Laser Interferen...
1、 Basic principlesHeterodyne laser interferometers typically consist of two coherent lasers, referred to as signal light and reference light, respectively. These two laser beams are split into two beams by a beam splitter, with one beam pa...
2024
12-10
What are the methods to control the flat...
The methods for controlling the flatness of double-sided polishing of 12 inch recycled wafers mainly include the following:1、 Adopting advanced polishing equipment and technologyDouble sided polishing equipment:Using double-sided polishing ...
2024
12-06
What are the process improvement methods...
The process improvement methods based on quartz glass epitaxial GaN mainly include the following aspects:1、 Optimization of wafer preparationMultiple thinning treatments:By using slurries and grinding discs of different materials to perform...
2024
12-06
What methods are available to remove waf...
The methods for removing edge defects in wafer bonding mainly include the following:1、 Chemical vapor deposition and planarization processMethod Overview:Provide wafers to be bonded.By using chemical vapor deposition, a layer of oxide film ...