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Optical microscopy 3D measurement
Optical microscopy 3D measurement
Step groove (Microscopic)
Surface Defect(Microscopic)
Warping/Straightness (Microscopic)
Surface roughness (Microscopic)
Step/groove (Macroscopic)
Angle/Radian(Macroscopic)
Flatness/Parallelism(Macroscopic)
Wafer TTV/BOW/WARPAGE(Macroscopic)
Non standard customized in-depth development
Non standard customized in-depth development
Real time monitoring of laser welding
Long distance thinning thickness monitor
High precision positioning of wafer coupling
Fusion of 2D/3D defect discrimination
3D Rotating Scanning of bore inner wall
Roundness and cylindricity runout
Large stroke sample measurement
Long distance 3D contour measurement
Microscopic dynamic 3D vibration testing
Microscopic dynamic 3D vibration testing
MEMS microphone
MEMS pressure sensing
MEMS cantilever
MEMS dynamic 3D amplitude
CMUT
MEMS comb shaped drive
MEMS comb shaped drive
MENS
Macro dynamic 3D vibration testing
Macro dynamic 3D vibration testing
Ultrasonic welding electrode
Bicycle bracket
Acoustical vibration
Turbine blade vibration
Automotive NVH
Drone wing vibration
Traffic speed measurement
Speed sensor
Optical microscopy 3D measurement
Optical microscopy 3D measurement
3D White Light Interference Imaging System
3D Spectral Confocal Imaging System
Wafer Thickness Mapping System
3D laser frequency comb imaging system
Non standard customized in-depth development
Non standard customized in-depth development
Real time monitoring of laser welding
Long distance thinning thickness monitor
High precision positioning of wafer coupling
Fusion of 2D/3D defect discrimination
3D Rotating Scanning of bore inner wall
Roundness and cylindricity runout
Large stroke sample measurement
Long distance 3D contour measurement
Microscopic dynamic 3D vibration testing
Microscopic dynamic 3D vibration testing
Microscopic laser vibrometer
Macro dynamic 3D vibration testing
Macro dynamic 3D vibration testing
Full field scanning laser vibrometer
Robot vibration measurement station
Single point laser vibrometer
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HOMETECHNICAL
  • Measurement Plan
  • Measuring Principle
  • Indicator Concept
  • Process Scheme
2024
11-01
After white light interference technolog...
Optical Frequency Comb (OFC) refers to a spectrum composed of a series of uniformly spaced frequency components with coherent and stable phase relationships on the spectrum. It is usually generated by a mode-locked laser, where each comb re...
2024
10-30
The poor flatness of the bonding surface...
The grinding methods for reducing wafer TTV (Total Thickness Variation) mainly include the following:1、 Adopting advanced grinding technologySilicon wafer rotary grinding:Principle: The monocrystalline silicon wafer and cup-shaped diamond g...
2024
09-21
What are the preparation methods for sin...
The preparation method of single-sided indium phosphide chips mainly includes the following steps:1、 Basic preparation processGrinding: Use grinding solution to grind InP (indium phosphide) chips. Grinding fluid usually contains water, Al2O...
2024
08-18
Vertical focusing detection
What is vertical focusing detection?Vertical focus detection (VFP) is based on the use of partial light cones. Individual light rays diffusely reflected from vertical surfaces are captured by the lens. Sidewings exceeding 90 ° can be measur...
2024
08-18
Surface parameters
Many times, the mechanical design of workpieces includes specifications that define parameters such as surface roughness or ripples. The Polytec TopMap surface measurement method based on white light interference principle can obtain the en...
2024
08-18
Compare ellipsometer and spectral reflec...
Spectral ellipsometer (SE) and spectral reflectometer (SR) both use the analysis of reflected light to determine the thickness and refractive index of dielectric, semiconductor, and metal thin films. The main difference between the two is t...
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400 6550 650

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