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Optical microscopy 3D measurement
Optical microscopy 3D measurement
Step groove (Microscopic)
Surface Defect(Microscopic)
Warping/Straightness (Microscopic)
Surface roughness (Microscopic)
Step/groove (Macroscopic)
Angle/Radian(Macroscopic)
Flatness/Parallelism(Macroscopic)
Wafer TTV/BOW/WARPAGE(Macroscopic)
Non standard customized in-depth development
Non standard customized in-depth development
Real time monitoring of laser welding
Long distance thinning thickness monitor
High precision positioning of wafer coupling
Fusion of 2D/3D defect discrimination
3D Rotating Scanning of bore inner wall
Roundness and cylindricity runout
Large stroke sample measurement
Long distance 3D contour measurement
Microscopic dynamic 3D vibration testing
Microscopic dynamic 3D vibration testing
MEMS microphone
MEMS pressure sensing
MEMS cantilever
MEMS dynamic 3D amplitude
CMUT
MEMS comb shaped drive
MEMS comb shaped drive
MENS
Macro dynamic 3D vibration testing
Macro dynamic 3D vibration testing
Ultrasonic welding electrode
Bicycle bracket
Acoustical vibration
Turbine blade vibration
Automotive NVH
Drone wing vibration
Traffic speed measurement
Speed sensor
Optical microscopy 3D measurement
Optical microscopy 3D measurement
3D White Light Interference Imaging System
3D Spectral Confocal Imaging System
Wafer Thickness Mapping System
3D laser frequency comb imaging system
Non standard customized in-depth development
Non standard customized in-depth development
Real time monitoring of laser welding
Long distance thinning thickness monitor
High precision positioning of wafer coupling
Fusion of 2D/3D defect discrimination
3D Rotating Scanning of bore inner wall
Roundness and cylindricity runout
Large stroke sample measurement
Long distance 3D contour measurement
Microscopic dynamic 3D vibration testing
Microscopic dynamic 3D vibration testing
Microscopic laser vibrometer
Macro dynamic 3D vibration testing
Macro dynamic 3D vibration testing
Full field scanning laser vibrometer
Robot vibration measurement station
Single point laser vibrometer
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HOMETECHNICALIndicator Concept
  • Measurement Plan
  • Measuring Principle
  • Indicator Concept
  • Process Scheme
2024
12-11
The difference between "display resoluti...
Display resolutionDefinition: Display resolution, also known as pixel resolution, refers to the resolution of a display when displaying an image. It represents the total number of horizontal and vertical pixels on the display. For example, ...
2024
12-02
How is the filtering value for roughness...
1、 Selection of Sampling Length and Evaluation LengthSampling length: It is a reference line length used to determine the surface roughness characteristics. It should be large enough to contain sufficient surface details to accurately refle...
2024
11-17
Why is the minimum roughness required to...
1、 Reduce the impact of other geometric shape errorsThe purpose of specifying the sampling length (i.e. a part or basis of the evaluation length) is to limit and reduce other geometric errors, especially the influence of surface wave roughn...
2024
11-15
What are the standards for roughness?
1、 Roughness evaluation parametersThe average arithmetic deviation Ra of the contour: the arithmetic mean of the absolute value of the contour offset within the sampling length. In actual measurement, the more measurement points there are, ...
2024
11-14
What is the laser resolution and how is ...
1、 Laser resolution of laser printerThe laser resolution in a laser printer refers to the minimum line width or dot matrix size that the printer can recognize and output during printing. It is usually expressed in dots per inch (DPI), which...
2024
11-13
Definition of TTV, Bow, Warp, TIR and ot...
TTV(Total Thickness Variation)Definition: TTV is the "total thickness variation" or "total thickness deviation" of a silicon wafer, which refers to the absolute difference between the maximum and minimum thickness of the measured wafer duri...
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400 6550 650

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