2024
11-13
Definition of TTV, Bow, Warp, TIR and ot...
TTV（Total Thickness Variation）Definition: TTV is the "total thickness variation" or "total thickness deviation" of a silicon wafer, which refers to the absolute difference between the maximum and minimum thickness of the measured wafer duri...
2024
11-12
Correlation between Poor Surface Flatnes...
Mechanical stress concentration:When the surface flatness of IGBT chips is poor, there may be uneven areas on the chip surface. These areas may experience mechanical stress concentration due to uneven stress distribution when subjected to e...
2024
11-12
The 3D imaging principle of the panorami...
1、 Basic principlesSuper depth microscope uses laser beams for three-dimensional imaging. It achieves three-dimensional imaging by using devices such as interference fringe microscopy and phase-shifting interference microscopy, combined wit...
2024
11-10
The Development and Evolution of OCT Opt...
1、 Origin and Basic Principles of TechnologyOCT (Optical Coherence Tomography) optical coherence tomography technology was first proposed by Chinese American scientists David Huang and others at the Massachusetts Institute of Technology in ...
2024
11-08
The technological evolution process of w...
1、 Initial application stageIn the 1950s and 1960s, some application type white light interferometers emerged both domestically and internationally. These interferometers mainly rely on manual operation, reading, calculation, and measuremen...
2024
11-07
Working principle and advantages and dis...
1、 Working principleThe blue light 3D scanner utilizes blue light projection heterodyne multi frequency phase shift technology for 3D scanning measurement. Specifically, it first projects blue light grating fringes onto the object being mea...