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Optical microscopy 3D measurement
Optical microscopy 3D measurement
Step groove (Microscopic)
Surface Defect(Microscopic)
Warping/Straightness (Microscopic)
Surface roughness (Microscopic)
Step/groove (Macroscopic)
Angle/Radian(Macroscopic)
Flatness/Parallelism(Macroscopic)
Wafer TTV/BOW/WARPAGE(Macroscopic)
Non standard customized in-depth development
Non standard customized in-depth development
Real time monitoring of laser welding
Long distance thinning thickness monitor
High precision positioning of wafer coupling
Fusion of 2D/3D defect discrimination
3D Rotating Scanning of bore inner wall
Roundness and cylindricity runout
Large stroke sample measurement
Long distance 3D contour measurement
Microscopic dynamic 3D vibration testing
Microscopic dynamic 3D vibration testing
MEMS microphone
MEMS pressure sensing
MEMS cantilever
MEMS dynamic 3D amplitude
CMUT
MEMS comb shaped drive
MEMS comb shaped drive
MENS
Macro dynamic 3D vibration testing
Macro dynamic 3D vibration testing
Ultrasonic welding electrode
Bicycle bracket
Acoustical vibration
Turbine blade vibration
Automotive NVH
Drone wing vibration
Traffic speed measurement
Speed sensor
Optical microscopy 3D measurement
Optical microscopy 3D measurement
3D White Light Interference Imaging System
3D Spectral Confocal Imaging System
Wafer Thickness Mapping System
3D laser frequency comb imaging system
Non standard customized in-depth development
Non standard customized in-depth development
Real time monitoring of laser welding
Long distance thinning thickness monitor
High precision positioning of wafer coupling
Fusion of 2D/3D defect discrimination
3D Rotating Scanning of bore inner wall
Roundness and cylindricity runout
Large stroke sample measurement
Long distance 3D contour measurement
Microscopic dynamic 3D vibration testing
Microscopic dynamic 3D vibration testing
Microscopic laser vibrometer
Macro dynamic 3D vibration testing
Macro dynamic 3D vibration testing
Full field scanning laser vibrometer
Robot vibration measurement station
Single point laser vibrometer
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HOMETECHNICAL
  • Measurement Plan
  • Measuring Principle
  • Indicator Concept
  • Process Scheme
2024
11-16
Poor surface flatness of IGBT chips can ...
1、 Reduced contact areaWhen the surface flatness of IGBT chips is poor, the contact surface between the chip and the heat sink will no longer be completely adhered. Due to the unevenness of the chip surface, some areas will not be able to f...
2024
11-15
Poor flatness of the bonding surface bet...
1、 The generation of mechanical stressWhen the flatness of the bonding surface between the bottom of the IGBT package and the heat sink is poor, perfect contact may not be formed between the package and the heat sink. During IGBT operation,...
2024
11-15
What are the standards for roughness?
1、 Roughness evaluation parametersThe average arithmetic deviation Ra of the contour: the arithmetic mean of the absolute value of the contour offset within the sampling length. In actual measurement, the more measurement points there are, ...
2024
11-14
Poor flatness of the bonding surface bet...
1、 The influence of heat conduction and heat dissipation effectIncreasing contact thermal resistance: Poor flatness of the IGBT package bottom and heat sink bonding surface can result in gaps between the contact surfaces, which can increase...
2024
11-14
What is the laser resolution and how is ...
1、 Laser resolution of laser printerThe laser resolution in a laser printer refers to the minimum line width or dot matrix size that the printer can recognize and output during printing. It is usually expressed in dots per inch (DPI), which...
2024
11-13
The correlation between the poor flatnes...
Decreased heat dissipation performance:When the flatness of the bonding surface between the bottom of the IGBT package and the heat sink is poor, the contact area between the two will decrease, and the degree of contact tightness will also ...
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400 6550 650

1001, No.119 Chuangqiang Road, Zengcheng District, Guangzhou, Guangdong, China

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