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Optical microscopy 3D measurement
Step groove (Microscopic)
Surface Defect(Microscopic)
Warping/Straightness (Microscopic)
Surface roughness (Microscopic)
Step/groove (Macroscopic)
Angle/Radian(Macroscopic)
Flatness/Parallelism(Macroscopic)
Wafer TTV/BOW/WARPAGE(Macroscopic)
Non standard customized in-depth development
Real time monitoring of laser welding
Long distance thinning thickness monitor
High precision positioning of wafer coupling
Fusion of 2D/3D defect discrimination
3D Rotating Scanning of bore inner wall
Roundness and cylindricity runout
Large stroke sample measurement
Long distance 3D contour measurement
Microscopic dynamic 3D vibration testing
MEMS microphone
MEMS pressure sensing
MEMS cantilever
MEMS dynamic 3D amplitude
CMUT
MEMS comb shaped drive
MEMS comb shaped drive
MENS
Macro dynamic 3D vibration testing
Ultrasonic welding electrode
Bicycle bracket
Acoustical vibration
Turbine blade vibration
Automotive NVH
Drone wing vibration
Traffic speed measurement
Speed sensor
Optical microscopy 3D measurement
3D White Light Interference Imaging System
3D Spectral Confocal Imaging System
Wafer Thickness Mapping System
3D laser frequency comb imaging system
Non standard customized in-depth development
Real time monitoring of laser welding
Long distance thinning thickness monitor
High precision positioning of wafer coupling
Fusion of 2D/3D defect discrimination
3D Rotating Scanning of bore inner wall
Roundness and cylindricity runout
Large stroke sample measurement
Long distance 3D contour measurement
Microscopic dynamic 3D vibration testing
Microscopic laser vibrometer
Macro dynamic 3D vibration testing
Full field scanning laser vibrometer
Robot vibration measurement station
Single point laser vibrometer
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Process Scheme
2024
11-12
Correlation between Poor Surface Flatnes...
Mechanical stress concentration:When the surface flatness of IGBT chips is poor, there may be uneven areas on the chip surface. These areas may experience mechanical stress concentration due to uneven stress distribution when subjected to e...
2024
10-30
The poor flatness of the bonding surface...
The grinding methods for reducing wafer TTV (Total Thickness Variation) mainly include the following:1、 Adopting advanced grinding technologySilicon wafer rotary grinding:Principle: The monocrystalline silicon wafer and cup-shaped diamond g...
2024
09-21
What are the preparation methods for sin...
The preparation method of single-sided indium phosphide chips mainly includes the following steps:1、 Basic preparation processGrinding: Use grinding solution to grind InP (indium phosphide) chips. Grinding fluid usually contains water, Al2O...
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