A visual data collection program that facilitates users to conduct intuitive and consistent measurements, analysis, and data output
A visual data collection program that facilitates users to conduct intuitive and consistent measurements, analysis, and data output
TTV measurement for various surface types that comply with SEMI standards BOW.WARP and others
TTV measurement for various surface types that comply with SEMI standards BOW.WARP and others
Provide comparative analysis of high-order residuals based on a given model
Provide comparative analysis of high-order residuals based on a given model
Suitable for heavily doped, rough, multi-layer structured, birefringent, low reflective and other types of wafers
Suitable for heavily doped, rough, multi-layer structured, birefringent, low reflective and other types of wafers
Customizable working distance greater than 1m to meet nanometer level thinning monitoring requirements
Customizable working distance greater than 1m to meet nanometer level thinning monitoring requirements
We can customize EFEM integration according to customer needs
We can customize EFEM integration according to customer needs

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3D相干断层扫描系统

3D相干断层扫描系统

Please refer to the product catalog for details

接触并了解在您生产线和生产过程中使用FocalSpec线共焦传感器的优势。


开始解决最具挑战性的扫描,测量和检测应用一从曲面玻璃到多层透明材料到高反光金属表面。FocalSpec线共焦传感器是最适合您的视觉解决方案。

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